HUAXIN HSM Series Semiconductor Vacuum Oven
SUMEC INTERNATIONAL TECHNOLOGY CO.,LTD
The supplier hasn’t listed a price. We can get their current prices and MOQ.
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HUAXIN HSM Series Semiconductor Vacuum Oven
SUMEC INTERNATIONAL TECHNOLOGY CO.,LTDThe supplier hasn’t listed a price. We can get their current prices and MOQ.
Verify from $29 · written report in 3 business days · 100% refund if unreachable
About this product
- Materials: See figure
- Size: See Image
- Color: See figure
- Power density: Other
- Application: Manufacturing IndustryPowder MetallurgyElectronic IndustryBiomedicineOtherAutomotive Industry
- Technical class: Other
- Exports to: Mainland China, Africa, Middle East, Southeast Asia, South Asia, Central Asia, USA and Canada, Latin America, Russia, EU, Other European Countries, Japan and South Korea, Hong Kong China, Macao China and Taiwan China, Others
About this product
- Materials: See figure
- Size: See Image
- Color: See figure
- Power density: Other
- Application: Manufacturing IndustryPowder MetallurgyElectronic IndustryBiomedicineOtherAutomotive Industry
- Technical class: Other
- Exports to: Mainland China, Africa, Middle East, Southeast Asia, South Asia, Central Asia, USA and Canada, Latin America, Russia, EU, Other European Countries, Japan and South Korea, Hong Kong China, Macao China and Taiwan China, Others
Product details
| Materials | See figure |
|---|---|
| Size | See Image |
| Color | See figure |
| Power density | Other |
| Application | Manufacturing IndustryPowder MetallurgyElectronic IndustryBiomedicineOtherAutomotive Industry |
| Technical class | Other |
| Laser classification | Semiconductor LaserOther |
Product details
| Materials | See figure |
|---|---|
| Size | See Image |
| Color | See figure |
| Power density | Other |
| Application | Manufacturing IndustryPowder MetallurgyElectronic IndustryBiomedicineOtherAutomotive Industry |
| Technical class | Other |
| Laser classification | Semiconductor LaserOther |
From the supplier
Features：
This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering; This equipment adopts industrial embedded control system, with dual CPU calculation, can run independently from the computer (computer crash), not only stable and reliable but also more accurate in temperature control, provide replaceable heating modules, to effectively solve the phenomenon of tin frying caused by temperature difference; E x c l u si v e p a t e n t e d fl u x & p a st e c o l l e c t i o n s y st e m r e d u c e s equipment maintenance and cleaning. The machine supports recipe functions for key soldering parameters and MES remote data reading. Intelligent nitrogen monitoring and control system, not only saves gas, but also has a lower oxygen content. Step-by-step vacuum design, up to 5 steps of vacuuming process. The patented water-cooled structure of the sealing ring, not only has a longer life and lower cost of use, but also reduces product damage caused by poor sealing. The maximum vacuum can reach 0. 1KPa, void rate: single void rate <0.5%, total rate <1%. The fastest cycle time is 25s, the highest efficiency and the heating time is about 30min. Perfect match for ASM and domestic DB equipment.
Specifications：
From the supplier
Features：
This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering; This equipment adopts industrial embedded control system, with dual CPU calculation, can run independently from the computer (computer crash), not only stable and reliable but also more accurate in temperature control, provide replaceable heating modules, to effectively solve the phenomenon of tin frying caused by temperature difference; E x c l u si v e p a t e n t e d fl u x & p a st e c o l l e c t i o n s y st e m r e d u c e s equipment maintenance and cleaning. The machine supports recipe functions for key soldering parameters and MES remote data reading. Intelligent nitrogen monitoring and control system, not only saves gas, but also has a lower oxygen content. Step-by-step vacuum design, up to 5 steps of vacuuming process. The patented water-cooled structure of the sealing ring, not only has a longer life and lower cost of use, but also reduces product damage caused by poor sealing. The maximum vacuum can reach 0. 1KPa, void rate: single void rate <0.5%, total rate <1%. The fastest cycle time is 25s, the highest efficiency and the heating time is about 30min. Perfect match for ASM and domestic DB equipment.
Specifications：
About the supplier
- ✓Exhibited at 2 recent Canton Fairs
- ✓Foreign Trade Company
- ✓Founded 1999
- ✓1 certificate on file
- Exhibited at 2 recent Canton Fairs
- Foreign Trade Company
- Founded 1999
- 1 certificate on file
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