JY19WB-2 fully automatic wire bonding machine is a desktop fully automatic bonding machine developed by Guangxi Jiayou Technology Co., Ltd. It is small in size and has image recognition function.

·Intelligent imaging system can adapt to the bonding requirements of deep cavities and complex structures

·Adapt to multiple process requirements, compatible with ordinary, BBOS, BSOP and ball placement bonding modes

·Adapt to a variety of materials, can adapt to metal substrate frames, PCB boards, ceramic substrates, composite substrates and flexible shackles.

·Various output forms, multiple pressure and ultrasonic output forms to adapt to various chips and substrates.

·The motion compensation system dynamically compensates for motion errors caused by mechanical structural deviations and wear.& nbsp;

·The automatic positioning system has an automatic detection and composite image positioning system, which can automatically correct angular and x-y-z position deviations caused by clamping or chip bonding of discrete devices and hybrid circuit modules.& nbsp;

·Chinese interface is easy to operate. This series of products uses the Chinese interface and has semi-automatic automatic bonding, process test and other bonding modes. It can set the bonding parameters of multiple bonding points, monitor the bonding process in real time, and establish a database to provide data and traceability basis for process analysis and adjustment and product quality control.