JCA,AG9500 Fully Automatic Grinder,Electronic equipment & Instruments
SUMEC INTERNATIONAL TECHNOLOGY CO.,LTD
The supplier hasn’t listed a price. We can get their current prices and MOQ.
Verify from $29 · written report in 3 business days · 100% refund if unreachable
JCA,AG9500 Fully Automatic Grinder,Electronic equipment & Instruments
SUMEC INTERNATIONAL TECHNOLOGY CO.,LTDThe supplier hasn’t listed a price. We can get their current prices and MOQ.
Verify from $29 · written report in 3 business days · 100% refund if unreachable
About this product
- Size: ·
- Color: ·
- Power supply: Other
- Customized: Customized
- Application: Other
- Imaging type: Other
- Exports to: Mainland China, Middle East, South Asia, USA and Canada, Russia
About this product
- Size: ·
- Color: ·
- Power supply: Other
- Customized: Customized
- Application: Other
- Imaging type: Other
- Exports to: Mainland China, Middle East, South Asia, USA and Canada, Russia
Product details
| Size | · |
|---|---|
| Color | · |
| Power supply | Other |
| Customized | Customized |
| Application | Other |
| Imaging type | Other |
Product details
| Size | · |
|---|---|
| Color | · |
| Power supply | Other |
| Customized | Customized |
| Application | Other |
| Imaging type | Other |
From the supplier
Advantage
Mature Stable Processing
In-Feed Main Spindle Feed Grinding - High Precision
Convenient operation and user interface
Precision Imported Ball Screws, Linear Guide Rails, High-Precision Motors for Z-Axis Control, Minimum Resolution 0.1um/s
High-Rigidity Air-Floating Spindle, High-Reliability Bearing Components With Precision Thickness Gauge
Function
Operation Log Recording
4-12 Inch Wafer and Similar Material Compatible
Real-time high-precision contact wafer thickness measurement
Spindle Water-Cooling System
Fully Automatic / Semi-Automatic Mode
Application
Silicon wafer, semiconductor compound materials, silicon carbide wafer, DSC power devices, substrate packaging devices, silicon carbide ingot
Parameters
From the supplier
Advantage
Mature Stable Processing
In-Feed Main Spindle Feed Grinding - High Precision
Convenient operation and user interface
Precision Imported Ball Screws, Linear Guide Rails, High-Precision Motors for Z-Axis Control, Minimum Resolution 0.1um/s
High-Rigidity Air-Floating Spindle, High-Reliability Bearing Components With Precision Thickness Gauge
Function
Operation Log Recording
4-12 Inch Wafer and Similar Material Compatible
Real-time high-precision contact wafer thickness measurement
Spindle Water-Cooling System
Fully Automatic / Semi-Automatic Mode
Application
Silicon wafer, semiconductor compound materials, silicon carbide wafer, DSC power devices, substrate packaging devices, silicon carbide ingot
Parameters
About the supplier
- ✓Exhibited at 2 recent Canton Fairs
- ✓Foreign Trade Company
- ✓Founded 1999
- ✓1 certificate on file
- Exhibited at 2 recent Canton Fairs
- Foreign Trade Company
- Founded 1999
- 1 certificate on file
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