The SD642 fully automatic wafer cutting machine is a high-end equipment specially created by Shenzhen Xinweiran Technology Co., Ltd. for precision processing of 8 to 12-inch (200-300mm) wafers. Strong core performance: spindle speed is as high as 60,000 to 80,000 RPM, feed speed is 0.1 to 1,000 mm/sec, X/Y axis straightness accuracy reaches 2μm/310mm, Z axis positioning accuracy reaches 1μm, and is equipped with an independent sharpening plate to ensure high-precision cutting. High degree of automation: Integrate the entire process of wafer loading, alignment, cutting, cleaning and unloading, greatly reducing manual reliance. The system has functions such as multi-mode cutting (one-way/two-way/ladder/multiple times), automatic alignment, real-time BBD fragment alarm, water and gas monitoring and visual detection. Solid hardware and configuration: equipped with dual 1.8kW spindles and porous suction cups (suitable for 8/12 inches), high-precision transmission of X/Y/Z axes, and matching touch screen interface. The equipment needs to match factory conditions such as 220/380V three-phase power supply, clean air and deionized water. In addition, plastic wafer processing, infrared microscopy and SECS II/GEM communication functions can be selected on demand, providing excellent comprehensive performance and wide adaptability.